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1N4154
General Description: The high breakdown voltage, fast switching speed and high forward conductance of this diode packaged in a DO-35 miniature Glass Axial leaded package makes it desirable also as a general purpose diode. Features:
DISCRETE POWER AND SIGNAL TECHNOLOGIES
* 500 milliwatt Power Dissipation package. * Fast Switching Speed, * Typical capacitance less than 1.0 picofarad. Ordering: * 13 inch reel, 50 mm (T50R) & 26 mm (T26R) Tape; 10,000 units per reel.
High Conductance Fast Diode
Absolute Maximum Ratings* Sym
Tstg TJ PD R OJA Wiv IO IF if iF(surge)
TA = 25OC unless otherwise noted
Parameter
Storage Temperature Operating Junction Temperature Total Power Dissipation at TA = 25OC Linear Derating Factor from TA = 25OC Thermal Resistance Junction-to-Ambient Working Inverse Voltage Average Rectified Current DC Forward Current (IF) Recurrent Peak Forward Current (IF) Peak Forward Surge Current (IFSM) Pulse Width = 1.0 second Pulse Width = 1.0 microsecond
Value
-65 to +200 175 500 3.33 300 35 100 300 400 1.0 4.0
CATHODE BAND MARKING LOGO 1N 41 54
Units
OC OC mW mW/OC OC/W V mA mA mA Amp Amp
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired 0.500 Minimum 12.70 Typ 1.000 0.200 (5.08) 0.120 (3.05)
0.022 (0.558) Diameter 0.018 (0.458) Typ 20 mils 0.090 (2.28) Diameter 0.060 (1.53)
Electrical Characteristics SYM BV IR VF CT TRR
TA = 25OC unless otherwise noted
CHARACTERISTICS Breakdown Voltage Reverse Leakage Forward Voltage Capacitance Reverse Recovery Time
MIN 35
MAX
UNITS V IR
TEST CONDITIONS = 5.0 uA 25 V 25 V, TA = 150OC 30 mA 0.0 V, f = 1.0 MHz
100 100 1.0 4.0 4.0
nA uA V pF ns
VR = VR = IF = VR =
IF = 10 mA VR = 6.0 V IRR = 1.0 mA, RL = 100 ohms
Revision A - September 21, 1998
(c) 1997 Fairchild Semiconductor Corporation
DO-35 Tape and Reel Data
DO-35 Packaging Configuration: Figure 1.0
Soabar Label Corrugated Outer Liner
White (Anode)
Red/Blue (Cathode)
T50R
TNR Options
Kraft Paper Wound Between Layers
DO-35 Packaging Information Table: Figure 2.0
DO-35 Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size (inch diameter) Inside Tape Spacing (mm) Int Box Dimension (mm) Max qty per Box Weight per unit (gm)
Weight per Reel/Ammo (kg)
T50R TNR 10,000 13 52 30,000 0.137 2.23
T50A Ammo 5,000 52 50,000 0.137 0.800
Standard (no flow code) Bag 500 -
Soabar Label sample
P.O. No. TYPE REV PKG QTY Q.C. 10,000 IN5225A A2 MARK PART No. EC No. M.O. No. DATE OX5046F035 D9903 BLK-BRN
254x79x794 406x267x184 279x133x108 5,000 0.137 Bulk
MFD. UNDER US PAT 3.025.589 & OTHER US PATS & APPLICATIONS
Note/Comments
DO-35 Reel Dimensions: Figure 3.0
Soabar Label
REEL DIMENSIONS
ITEM DESCRIPTION D1 Reel Diameter Arbor Hole Diameter (Standard) D2 Core Diameter Flange to Flange Inner Width D1 D2 D3 W1 10.375 1.245 3.190 10.625 1.255 3.310 3.400 SYMBOL MINIMUM MAXIMUM
Note: All Dimensions are in inches
W1
D3
September 1999, Rev. A
DO-35 Tape and Ammo Data
DO-35 Ammo Packing Configuration: Figure 4.0
Soabar Label (on top of box)
254mm x 79mm x 79mm Intermediate Container (5,000 cap)
T50A Option
DO-35 Taping Dimension: Figure 5.0
G
H TAPING DIMENSIONS INCH
A 2.520 +0.066/ -0.027 2.0470.027 0.200 0.0157 0.047(max) 0.022(max) 0.027(max) 0.126(min) 0 0.027
MM
64.00 +1.69/ -0.69 52 0.69 5.08 0.40 1.2(max) 0.55(max) 0.69 3.2(min) 0 0.69
MILS
2519 +66.5/ -27.0 204727 200 15.7 47(max) 22(max) 27 126(min) 0 27
NOTES
Overall width
L1 F B A
B C D E
Inside Tape Spacing Component Pitch Component Misalignment Tape Mismatch Units in line w/ one another Lead amount between tapes Lead amount beyond tapes Delta between two leads
L2
F G H
E C D
L1-L2
DO-35 Bulk Packing Configuration: Figure 6.0
102mm x 76mm x 127mm Immediate Box (1,000 cap) 133mm x 95mm Anti-static bag (500/bag)
September 1999, Rev. A
DISCRETE POWER AND SIGNAL TECHNOLOGIES
STANDARD DIGITAL MARKING CRITERIA MAXIMUM CHARACTERS PER LINE: 3 MAXIMUM NUMBER OF LINES: 4 LOGO AND CHARACTERS M & W COUNT AS 2 CHARACTERS EACH
0.021 (0.533) Diameter 0.019 (0.483)
LEADS: COPPER CLAD STEEL TYPICAL 20 Mils LEADS TIN DIPPED (60% SN 40% PB) STUDS: DUMET (ALLOY 42)
GLASS SLEEVE
0.150 (3.810) 0.140 (3.556)
CATHODE BAND
1.105 (28.067) 1.081 (27.457)
0.050 (1.270) Maximum
SEE NOTE 1 BELOW
Package Weight 0.14 grams
0.074 (1.880) Diameter 0.068 (1.727)
NOTE 1: LEAD DIAMETER NOT CONTROLLED IN THIS ZONE TO ALLOW FOR FLASH, LEAD FINISH BUILD-UP, & MINOR IRREGULARITIES OTHER THAN SLUGS.
DO-35 PACKAGE
Fairchild Semiconductor's Criteria
11-MAR-97
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM CoolFETTM CROSSVOLTTM E2CMOSTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM GTOTM HiSeCTM
DISCLAIMER
ISOPLANARTM MICROWIRETM POPTM PowerTrench QFETTM QSTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8
SyncFETTM TinyLogicTM UHCTM VCXTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. D

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